Raws li txoj kev sib dhos, cov khoom siv hluav taws xob tuaj yeem muab faib ua cov khoom siv los ntawm lub qhov thiab qhov chaw mount (SMC).Tab sis nyob rau hauv kev lag luam,Surface Mount Devices (SMDs) yog siv ntau los piav txog qhov no ntotiv thaiv uas yog siv hauv cov khoom siv hluav taws xob uas txuas ncaj qha mus rau saum npoo ntawm lub rooj tsav xwm luam tawm (PCB).SMDs tuaj nyob rau hauv ntau hom ntim, txhua tus tsim rau lub hom phiaj tshwj xeeb, qhov chaw txwv, thiab kev tsim khoom.Nov yog qee hom kev ntim khoom SMD:
1. SMD Chip (Rectangular) Pob:
SOIC (Small Outline Integrated Circuit): Ib lub pob ntawv nrog gull-tis ua rau ob sab, haum rau kev sib xyaw ua ke.
SSOP (Shrink Small Outline Package): Zoo ib yam li SOIC tab sis nrog lub cev me me thiab lub suab zoo dua.
TSSOP (Thin Shrink Small Outline Package): Ib daim ntawv nyias nyias ntawm SSOP.
QFP (Quad Flat Package): Ib pob square lossis duab plaub nrog cov coj ntawm plaub sab.Nws tuaj yeem ua tau qis-profile (LQFP) lossis zoo-pitch (VQFP).
LGA (Land Grid Array): Tsis muaj kev coj;Hloov chaw, cov ntaub ntawv tiv tauj tau teem rau hauv kab sib chaws ntawm qhov chaw hauv qab.
2. SMD Chip (Square) Pob:
CSP (Chip Scale Package): Tsis tshua muaj kev cog lus nrog cov khoom siv hluav taws xob ncaj qha rau ntawm cov khoom ntawm cov npoo.Tsim los kom ze rau qhov loj ntawm cov nti tiag tiag.
BGA (Ball Grid Array): Cov npas solder teem rau hauv kab sib chaws hauv qab pob, muab kev ua haujlwm zoo thermal thiab hluav taws xob.
FBGA (Fine-Pitch BGA): Zoo ib yam li BGA tab sis nrog lub suab zoo dua rau cov khoom siv ntau dua.
3. SMD Diode thiab Transistor Pob:
SOT (Small Outline Transistor): Cov pob me me rau diodes, transistors, thiab lwm yam khoom me me.
SOD (Small Outline Diode): Zoo ib yam li SOT tab sis tshwj xeeb rau diodes.
DO (Diode Outline): Ntau pob me me rau diodes thiab lwm yam khoom me me.
4.SMD Capacitor thiab Resistor Pob:
0201, 0402, 0603, 0805, thiab lwm yam .Piv txwv li, 0603 qhia txog qhov ntsuas 0.06 x 0.03 nti (1.6 x 0.8 mm).
5. Lwm cov pob SMD:
PLCC (Plastic Leaded Chip Carrier): Square lossis duab plaub pob nrog cov txhuas ntawm plaub sab, haum rau ICs thiab lwm yam khoom.
TO252, TO263, thiab lwm yam .: Cov no yog SMD versions ntawm cov tsoos los ntawm lub qhov sib xyaw pob khoom xws li TO-220, TO-263, nrog lub tiaj tiaj rau saum npoo.
Txhua yam ntawm cov pob no muaj nws qhov zoo thiab qhov tsis zoo ntawm qhov loj me, yooj yim ntawm kev sib dhos, kev ua haujlwm thermal, cov yam ntxwv hluav taws xob, thiab tus nqi.Kev xaiv ntawm SMD pob nyob ntawm cov yam ntxwv xws li cov khoom siv ua haujlwm, qhov chaw muaj lub rooj tsavxwm, kev tsim muaj peev xwm, thiab cov kev xav tau thermal.
Post lub sij hawm: Aug-24-2023
